AP3 QFP64-1.02 PIC-1
Order No.: 73-3590

specialized programming module for Microchip PIC devices in QFP64 package
operation (mechanical) life of ZIF socket - 10.000 actuations
supported from PG4UW software version 3.32u

Ord. no. 73-3590
Socket ZIF QFP64, open top type
Bottom 2 connectors by 68 pins, receptacle type
Class Specialized
Subclass PICmicro

Order no.: 73-3590
Price:        € 282,00

Module manual

  • Programmer don't need to be switched off and SW can be running during inserting/removing programming module
  • Protect the contacts of module's connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming
  • Proceed with care! Incorrect insertion of device in module's ZIF socket may lead to programmed device damage
  • Unscrew knurled thumb screw. Properly Insert programming module into Programmer Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programmer Module Interface connectors is possible. Screw knurled thumb screw to fix programming module to programmer.
  • Push the cover of module's ZIF socket (the topmost movable part) to open the socket. Insert the device into module's ZIF socket. Correct position of programmed device in module's ZIF socket is indicated by picture near (usually on left above) the module's ZIF socket. On that picture, reference corner of device (e.g. position of pin 1) is indicated by dot, by number 1, by bevelled corner or by any combination of mentioned. Then release module's ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket. If device is inserted into only partially opened ZIF socket, then - after releasing of cover – device pins might be damaged.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in module's ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from module, push the cover of module's ZIF socket and remove the device.
  • When you finish the work with module, unscrew knurled thumb screw and remove the module from Programmer Module Interface connectors.
  • For handling with the device we recommended to use a vacuum pick up tool.
  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Accepted package(s)



 Back to top

The information in this document are subject to change without notice.