 |
Click on Data Sheet for further information
about:
-Part Number Details
for
Socket / Carrier
-Socket
Dimensions
-Carrier Dimensions
-Pin Counts
(max.)
-Personalized Grid
-Contact
Details
 Full Data Sheet
|
| PDF File: 135KB | |
| Series: YED514 / 550
/558 |
| Title: Ball Grid Array with Carrier Sytem
- SMT (BGA) |
| |
|
| Features |
|
- Contacts are arranged in grid paterns with a
pitch of 1.00, 1.50, 1.27and 2.54mm. Any pin count
and pin layout within the
given grids is available
- The best way to make BGA pluggable without
changing layout design
- The socket and PCB adapter provide a high
density
and low profile board interconnect
system |
| |
|
| Specifications |
|
| Insulation Resistance: |
10,000M
min. at 500VRMS |
| Dielec. Withstd. Voltage: |
500VRMS |
| Max
Working Voltage |
100Vrms/150VDC for >1.27mm |
| Max
Working Voltage |
50Vrms/60VDC for >1.00mm |
| Contact Resistance: |
10m
max. at 100mA/20mV |
| Current Rating: |
1A |
| Operating Temp. Range: |
-55°C ~ +125°C |
| Capacitance: |
max. 1pF at 1kHz |
| Mating Cycles: |
max. 2nH per pin. |
| Mating Cycles: |
100
insertions min. |
|
|
| Materials and Finish |
|
| Insulator: |
Laminated glass-epoxy FR4
UL94V-0 |
| Contacts(stamped): |
Beryllium Copper, clip Gold over
Nickel |
| Sleeve (machined): |
Brass, Tin Lead over Nickel |
| Adapter Pins (machined): |
Brass, Gold
over
Nickel | | |
