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Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-PCB Layout
-Matching IC
Dim.
 Full Data Sheet
|
| PDF file size:
41KB | |
| Series: IC264 - Open
Top |
| Title: Ball Grid Array
(BGA) |
| |
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| Features |
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- Open top type
sockets for BGA packages, with push-down frame for
automated handling
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| Specifications |
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| Insulation Resistance: |
1,000M min. at 500V DC |
| Dielec. Withstd. Voltage: |
100V AC for 1 minute |
| Contact Resistance: |
1 max. at 10mA/20mV
max. |
| Operating Temp. Range: |
–40°C to +150°C |
| Mating Cycles: |
10,000 insertions min. |
| Contact force: |
25g to 35g per individual
contact
pin |
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| Materials and Finish |
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| Housing: |
Polyetherimide (PEI), glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold over
Nickel | | |
