 |
|
Click on Data
Sheet for further information about:
-Part Number
Details -Socket Dimensions -IC Dimenstions
-PCB
Layouts
See Table Below
| |
| Series: NP351 - Open Top
(ZIF) |
| Title: Fine Ball Grid Array
(FBGA) |
| |
|
| Features |
|
- Pin counts from
48 to 520
|
|
|
- Open top type
sockets for FBGA packages
|
- Self contacting
structure without upper pressing force
(ZIF)
|
- Contacting
structure to nip the sides of solder balls
to
lower damages of coplanarity of solder
balls
|
|
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 100V DC |
| Dielec. Withstd. Voltage: |
100V AC for 1 minute |
| Contact Resistance: |
100m max. at 10mA/20mV
max. |
| Operating Temp. Range: |
–55°C to +150°C |
| Contact force: |
15g per pin approx. |
| Mating
Cycles: |
10,000
insertions |
|
|
| Materials and
Finish |
|
| Housing: |
Polyetherimide (PEI), glass-filled Polyetherssulphone
(PES), glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold
over
Nickel | | |