|
|
| Series: IC280 -
Clamshell |
| Title: Fine Ball Grid Array
(FBGA) |
| |
|
| Features |
|
- Pin counts 169, 196, 209, 225, 256, 257, 324,
340, 484,576, 671, 696, 720, 729, 740 and
868
|
- Pitch sizes 0.75, 0.8 and 1.0mm
|
- Clamshell socket for FBGA packages
|
- V-shape contact structure to lower the damage
of coplanarity of solder balls
|
| |
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 500V DC |
| Dielec. Withstd. Voltage: |
700V AC for 1 minute
for 1.0mm
pitch
500V AC for 1 minute
for 0.8mm
pitch
100V AC for 1 minute
for 0.75mm
pitch |
| Contact Resistance: |
30m max. at 10mA/20mV max. |
| Operating Temp. Range: |
–40°C to +150°C |
| Contact force: |
15g~35g within contact travel distance
between 0.2~0.5mm |
| Mating
Cycles: |
10,000
insertions |
|
|
| Materials and
Finish |
|
| Housing: |
Polyethersulphone (PES), glass-filled and
Polyetherimide
(PEI), glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold
over
Nickel | | |
