 |
Click on
Data Sheet for further information about:
-Part Number
Details
-Socket Dimensions
-IC
Dimensions
 Full Data Sheet
|
| PDF file size:
84KB | |
| Series: NP291 - Open
Top |
| Title: Fine Ball Grid Array
(FBGA) |
| |
|
| Features |
|
- Pin counts 36,
40, 44, 48, 54, 56, 72, 168 and 288
|
|
|
- Open top type
sockets for FBGA packages
|
- Self contacting
structure without upper pressing force
package
|
- Contacting
structure to nip the sides of solder balls
to
lower damages of coplanarity of solder
balls
|
| |
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 100V DC |
| Dielec. Withstd. Voltage: |
100V AC for 1 minute |
| Contact Resistance: |
100m max. at 10mA/20mV
max. |
| Operating Temp. Range: |
–55°C to +170°C |
| Contact force: |
15g per pin approx. |
|
|
| Materials and
Finish |
|
| Housing: |
Polyetherimide (PEI), glass-filled
Polyetherssulphone
(PES), glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold
over
Nickel | | |
