DIL48/TFBGA232 ZIF-CS MT-AP00300
Order No.: 70-3668

specialized adapter for MTK MT-AP00300 devices in TFBGA232 package
used socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness
The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board
operation (mechanical) life of ZIF socket - 250.000 actuations
supported from PG4UW software version 3.20u

Ord. no. 70-3668
Socket ZIF BGA232, ClamShell type
Bottom 2x24 pins square, 0.6x0.6mm
Class Specialized
Subclass other

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Order no.: 70-3668
Price:        €

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • Visually check the placement of adapter in programmer's ZIF socket.
  • Release the pawl on adapter's ZIF socket to open it. The socket cap will open by spring force. Insert the device into adapter's ZIF socket. The correct position of the programmed device in adapter BGA ZIF socket is shown inside ZIF socket of the adapter. The reference corner (position of pin A1) of the device is indicated by triangle.
  • Visually check the placement of programmed device in adapter's ZIF socket. If it looks OK, close adapter's ZIF socket cap by hand and secure the pawl.
  • To take out the device from adapter, release the pawl on adapter's ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer's ZIF socket.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

 

Accepted package(s)

BGA package  

 

NAME

SYMBOL MIN NOM MAX

Profile

A - - 1.2

Ball Height

A1 0.16 0.21 0.26

Body Thickness

A2 0.8 0.86 0.92

Ball Diameter

b 0.25 0.3 0.35

Body Size

D 10.3 10.4 10.5

Body Size

E 10.3 10.4 10.5

Ball Pitch

e - 0.65 -

Ball Array D

GD - 16 -

Ball Array E

GE - 16 -
 

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The information in this document are subject to change without notice.