DIL8/BGA12-1 ZIF-CS SFlash-1
Order No.: 70-3368

specialized adapter for Serial Flash devices in package WLCSP12 4.02x2.08mm, pitch 0.5mm.
Used ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA adapter
operation (mechanical) life of ZIF socket - 500.000 actuations
supported from PG4UW software version 3.14b

Ord. no. 70-3368
Socket ZIF BGA12, ClamShell type
Bottom 2 rows, 2x24 pins square, 0.6x0.6mm
Class Specialized
Subclass EPROM/Flash

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Order no.: 70-3368
Price:        €

Adapter manual

  • Insert adapter to the device programmer ZIF socket according to the picture placed near of it. If you have some doubts about orientation of this adapter in device programmer ZIF socket, it is valid general rule, the orientation of the text of title is the same as the text on the top of the device programmer.
  • Open the adapter ClamShell ZIF socket. Insert the device inside (place device on contacts). The right position of the programmed device in adapter BGA ZIF socket is shown on body of adapter. The reference corner (position of pin A1) of the device is indicated by dot.
  • Visually check interconnection between device and adapter ClamShell ZIF socket. If everything looks OK, close it and now, device is ready for programming.
  • Be careful, because the incorrect insertion of adapter to the device programmer ZIF socket or device to the adapter ClamShell ZIF socket can damage the programmed device.
  • To take out the device, open adapter ClamShell ZIF socket and remove device from it.
  • When you finish work with adapter, remove it from the device programmer ZIF socket.
  • Do not directly touch the pins of the adapter and adapter ZIF socket, because dirt may cause errors during programming of device.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  

 

NAME

SYMBOL MIN NOM MAX

Profile

A 0.42 0.47 0.52

Ball Height

A1 0.152 0.167 0.182

Body Thickness

A2 - - -

Ball Diameter

b 0.24 0.3 0.36

Body Size

D 4 4.02 4.04

Body Size

E 2.06 2.08 2.1

Ball Pitch

e - 0.5 -

Ball Array D

GD - 6 -

Ball Array E

GE - 4 -
 

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The information in this document are subject to change without notice.