BGA-Top-182 ZIF-CS
Order No.: 70-0964

top board of BGA adapters
used socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
operation (mechanical) life of ZIF socket - 500.000 actuations

Ord. no. 70-0964
Socket ZIF BGA64, ClamShell type
Bottom 4x25 pins square, 0.6x0.6mm
Subclass BGA-Top

Move the cursor over the picture for additional view

Order no.: 70-0964
Price:        € 430,00

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-182 ZIF-CS  with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  





A - - 1.4

Ball Height

A1 0.4 - -

Body Thickness

A2 0.6 - -

Ball Diameter

b 0.5 0.6 0.7

Body Size

D - 9 -

Body Size

E - 9 -

Ball Pitch

e - 1 -

Ball Array D

GD - 8 -

Ball Array E

GE - 8 -

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The information in this document are subject to change without notice.