BGA-Top-131 ZIF-CS
Order No.: 70-0725

top board of BGA adapters
used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operation (mechanical) life of ZIF socket - 500.000 actuations

Ord. no. 70-0725
Socket ZIF BGA80 (depopulated array of (64) spring probes), ClamShell type
Bottom 4 rows, 4x25 pins square, 0.6x0.6mm
Subclass BGA-Top

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Order no.: 70-0725
Price:        € 450,00

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-131 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  





A - - -

Ball Height

A1 0.4 - -

Body Thickness

A2 1 - -

Ball Diameter

b 0.5 0.6 0.7

Body Size

D - 13. -

Body Size

E - 11 -

Ball Pitch

e - 1 -

Ball Array D

GD - 8 -

Ball Array E

GE - 8 -

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The information in this document are subject to change without notice.