BGA-Top-107 ZIF
Order No.: 70-0614

top board of BGA adapters
used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness. The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
operation (mechanical) life of ZIF socket - 10.000 actuations.
Ord. no. 70-0614
Socket ZIF BGA48, open top type
Bottom 4 rows, 4x25 pins, square, 0.6x0.6mm
Subclass BGA-Top

Order no.: 70-0614
Price:        € 320,00

Converter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-107 ZIF with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • Insert complete adapter into programmer's ZIF socket. If you are in doubts about orientation of the adapter in programmer's ZIF socket, there is a rule of thumb - orientation of adapter's name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer's ZIF socket.
  • Push the cover of adapter's ZIF socket (the topmost movable part) to open the socket. Once fully actuated, insert the device into the socket. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter's ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in adapter's ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter's ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer's ZIF socket.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package




A - - 1.2

Ball Height

A1 0.2 - -

Body Thickness

A2 0.84 - 0.94

Ball Diameter

b 0.25 0.3 0.35

Body Size

D - 12 -

Body Size

E - 6 -

Ball Pitch

e - 0.8 -

Ball Array D

GD - 8 -

Ball Array E

GE - 6 -

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The information in this document are subject to change without notice.