DIL48/BGA100 ZIF ARM-2
Order No.: 70-3350

specialized adapter for Atmel ATSAM4S8CA-CU devices in TFBGA100 package
used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operation (mechanical) life of ZIF socket - 10.000 actuations
supported from PG4UW software version 3.11j

Ord. no. 70-3350
Socket ZIF BGA100, open top type
Bottom 2 rows, 2x24 pins square, 0.6x0.6mm,  row spacing 600mil
Class Specialized
Subclass ARM

Order no.: 70-3350
Price:        € 450,00

Converter manual

  • Protect the contacts of adapters's connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • Insert converter to the device programmer ZIF socket according to the picture placed near of it. If you have some doubts about orientation of this converter in device programmer ZIF socket, it is valid general rule, the orientation of the text of title is the same as the text on the top of the device programmer.
  • Push the top of adapter ZIF socket to open it. Insert the device into the adapter ZIF socket. The right position of the programmed device in adapter ZIF socket is show at picture near (mainly left above) the adapter ZIF socket. On this picture reference corner (e.g. position of pin 1) of device is indicated by dot, by number 1, by bevelled corner or by any combination of them. Then release adapter ZIF socket.
  • Visually check interconnection between device and adapter ZIF socket. If everything looks OK, the device is ready for programming.
  • Be careful, because the incorrect insertion of converter to the device programmer ZIF socket or device to the converter ZIF socket can damage the programmed device.
  • The cover must be fully actuated (depressed) before inserting a device into the socket. If device is inserted into only partially opened ZIF socket, then - after releasing of cover - the tweezer contacts might bend and if repeated several times this way tweezer contacts might even break.
  • Do not press on device while inserting it and/or releasing the cover.
  • When you finish work with adapter, remove it from the device programmer ZIF socket.
  • To take out the device, open converter ZIF socket and remove device from it.
  • When you finish work with converter, remove it from the programmer ZIF socket.
  • Do not directly touch the pins of the converter and converter ZIF socket, because dirt may cause errors during programming of device.
  • Operation conditions: operating temperature 5°C - 40°C (41°F - 104°F), operating humidity 20%...80%, non condensing.

Accepted package(s)

BGA package  

 

NAME

SYMBOL MIN NOM MAX

Profile

A - - 1.1

Ball Height

A1 0.25 0.3 0.35

Body Thickness

A2 0.67 0.71 0.75

Ball Diameter

b 0.35 0.4 0.45

Body Size

D 8.95 9 9.05

Body Size

E 8.95 9 9.05

Ball Pitch

e - 0.8 -

Ball Array D

GD - 10 -

Ball Array E

GE - 10 -

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The information in this document are subject to change without notice.