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Converter

BGA-Top-267 ZIF-CS

  • top board of BGA converters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operation (mechanical) life of ZIF socket - 500.000 actuations
  • socket: ZIF BGA64, ClamShell type
  • bottom: 4 rows, 4x25 pins, square, 0.6x0.6mm
  • Order no.: 70-2377
  • Price: € 410,00

Converter manual

  • For work with BGA device it is necessary put together BGA-Top-267 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter
  • For handling with the device we recommended to use a vacuum pipette pick up tool.

    Accepted package(s)

    BGA package

    		  

    NAME

    		 SYMBOL MIN NOM MAX

    Profile

    		 A - - 1.4

    Ball Height

    		 A1 0.4 0.49 -

    Ball Thickness

    		 A2 - 0.8 -

    Ball Diameter

    		 b 0.5 0.55 -

    Body Size

    		 D 12.9 13 13.1

    Body Size

    		 E 10.9 11 11.1

    Ball Pitch

    		 e -  1 -

    Ball Array D

    		 GD - 8 -

    Ball Array E

    		 GE - 8 -
     
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