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Converter
BGA-Top-265 ZIF
- top board of BGA converters
- ZIF socket accepts many variations of BGA packages, that differ in ball
diameter, ball width
and package thickness.
- The picture at Accepted package(s) section
shows the range of all dimensions of BGA packages,
which are accepted by this BGA-Top board.
- operation (mechanical) life of ZIF socket -
10.000 actuations
- socket: ZIF BGA107,
open top type
- bottom: 4 rows, 4x25 pins
- Order no.:
70-2361
- Price: € 429,00
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Converter manual
- For work with BGA device it is
necessary put together BGA-Top-265 ZIF with some
BGA-Bottom-x board according to the information
provided by PG4UW software.
- The top cover must be
fully actuated (depressed) before inserting a
package into the socket. If the chip is inserted
into only partially opened ZIF socket, then - after
releasing of top - the tweezer contact might bend
and if more times done by this way also tweezer
contact can be broken.
- The top cover must be fully
actuated (depressed) before inserting a package into
the socket.
- Once fully actuated, drop the
package into the socket from a height of 2 to 3mm
above the seating plane.
- Do not push package while loading
or releasing the lid.
- Do not directly touch the pins of
the converter, because dirt may cause errors during
programming of device.
- The picture show, how to put
together the BGA-Top-x ZIF-CS and BGA-Bottom-x
boards to have complete BGA converter
- For handling with the
device we recommended to use a
vacuum
pipette pick up tool.
- The picture show, how to put
together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards
to have complete BGA converter .
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Accepted package(s)
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BGA
package
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