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Converter
BGA-Top-186 ZIF-CS
- top board of BGA
converters
- ZIF socket accepts
many variations of BGA packages, that differ in ball
diameter, ball width and package thickness.
- The picture at
Accepted package(s) section shows the range of all
dimensions of BGA packages, which are accepted by
this BGA-Top board.
- operation (mechanical)
life of ZIF socket - 500.000 actuations
- socket: ZIF BGA88,
ClamShell type
- bottom: 4 rows, 4x25
pins, square, 0.6x0.6mm
- Order no.:
70-1038
- Price: €
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Converter manual
- For work with BGA
device it is necessary put together BGA-Top-186
ZIF-CS with some BGA-Bottom-x board according to the
information provided by PG4UW software.
- Do not directly touch
the pins of the converter, because dirt may cause
errors during programming of device.
- For handling with the
device we recommended to use a
vacuum pipette pick up tool.
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The picture show, how to put together the BGA-Top-x
ZIF-CS and BGA-Bottom-x boards to have complete BGA
converter
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Accepted package(s)
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BGA package
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
095 |
1.08 |
1.2 |
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Ball Height
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A1 |
0.28 |
0.38 |
0.48 |
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Ball Thickness
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A2 |
- |
- |
- |
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Ball Diameter
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b |
0.4 |
0.45 |
0.5 |
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Body Size
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D |
12.9 |
13 |
13.1 |
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Body Size
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E |
9.9 |
10 |
10.1 |
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Ball Pitch
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e |
- |
0.8 |
- |
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Ball Array D
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GD |
- |
12 |
- |
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Ball Array E
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GE |
- |
8 |
- |
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
08 |
0.9 |
1 |
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Ball Height
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A1 |
0.27 |
0.32 |
0.37 |
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Ball Thickness
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A2 |
- |
- |
- |
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Ball Diameter
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b |
0.4 |
0.45 |
0.5 |
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Body Size
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D |
12.9 |
13 |
13.1 |
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Body Size
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E |
9.9 |
10 |
10.1 |
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Ball Pitch
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e |
- |
0.8 |
- |
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Ball Array D
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GD |
- |
12 |
- |
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Ball Array E
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GE |
- |
8 |
- |
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