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Converter

BGA-Top-10 ZIF-CS

  • top board of BGA converters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operation (mechanical) life of ZIF socket - 500.000 actuations
  • accessory for BeeProg, JetProg, LabProg+ and LabProg-48LV
  • socket: ZIF BGA64, ClamShell type
  • bottom: 4 rows, 2x 25 pins, square, 0.6x0.6mm
  • Order no.: 70-0264
  • Price: € 430,00

Converter manual

  • For work with BGA device it is necessary put together BGA-Top-10 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
  • For handling with the device we recommended to use a vacuum pipette pick up tool.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter.

 

Accepted package(s)

BGA Gehäuse

NAME

SYMBOL MIN NOM MAX

Profile

A 1.15 1.25 1.4

Ball Height

A1 0.28 0.38 0.48

Ball Thickness

A2 - - -

Ball Diameter

b 0.4 0.45 0.55

Body Size

D 11.5 11.6 11.7

Body Size

E 7.9 8 8.1

Ball Pitch

e 0.8 -

Ball Array D

GD - 12 -

Ball Array E

GE - 10 -

NAME

SYMBOL MIN NOM MAX

Profile

A - - 1.4

Ball Height

A1 0.28 0.38 0.48

Ball Thickness

A2 - - -

Ball Diameter

b 0.4 0.45 0.55

Body Size

D 11.5 11.6 11.7

Body Size

E 7.9 8 8.1

Ball Pitch

e 0.8 -

Ball Array D

GD - 12 -

Ball Array E

GE - 10 -

NAME

SYMBOL MIN NOM MAX

Profile

A 1.09 1.19 1.34

Ball Height

A1 0.29 0.39 0.49

Ball Thickness

A2 - - -

Ball Diameter

b 0.4 0.45 0.55

Body Size

D 11.5 11.6 11.7

Body Size

E 7.9 8 8.1

Ball Pitch

e 0.8 -

Ball Array D

GD - 12 -

Ball Array E

GE - 10 -
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