 |
|
Click on Data
Sheet for further information about:
-Part Number
Details -Socket Dimensions -IC Dimensions
-PCB
Layouts
See Table Below
| |
| Series: NP276 - Zero Insertion Force
(Open Top) |
| Title: Ball Grid Array
(BGA) |
| |
|
| Features |
|
- Any amount of
pin counts are possible
|
|
|
- Open top type
sockets for BGA packages
|
- Self contacting
structure without upper pressing force (ZIF)
|
- Changes to the
IC ball flatness are minimized by contacting the ball
from the side to protect it from damage
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 500V DC |
| Dielec. Withstd. Voltage: |
100V AC for 1 minute |
| Contact Resistance: |
30m max. at 10mA/20mV max. |
| Operating Temp. Range: |
–55°C to +150°C –40°C to +170°C max.
for NP276-11904-x |
| Contact force: |
30g per pin approx. |
| Mating
Cycles: |
10,000
insertions |
|
|
| Materials and
Finish |
|
| Housing: |
Polyetherimide (PEI), glass-filled Polyetherssulphone
(PES), glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold
over
Nickel | | |