|
|
| Series: IC51 - Clamshell |
| Title: Quad Flat Package (QFP, PQFP, TQFP and
MQUAD)) |
| |
|
| Features |
|
|
|
- Pitch
sizes 0.4, 0.5, 0.65, 0.8 and 1.0mm
|
- High
reliability, durability and temperature range
|
- Custom
made also available for high pin count and fine-pitch IC
packages
|
| |
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 100V DC, 500V DC |
| Dielec. Withstd. Voltage: |
for 1 minute at 100V AC, 500V AC, 700V AC (socket dependent) |
| Contact Resistance: |
30m
max. at 10mA/20mV max. |
| Operating Temp. Range: |
(PEI/PSF) –40°C to +150°C
(PES) -55°C to +170°C
(PEI) -55°C to
+170°C |
|
|
| Materials and Finish |
|
| Housing: |
Polysulphone
(PSF)
Polyethersulphone (PES)
Polyetherimide
(PEI) |
| Contacts: |
Beryllium
Copper (BeCu) |
| Plating: |
Gold over
Nickel | | |
