 |
Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-IC Dimensions
-PCB
Layout
 Full Data Sheet
|
| PDF file size:
72KB | |
| Series: IC363-Open
Top |
| Title: Thin Small Outline Package (TSOP
II) |
| |
|
| Features |
|
|
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- Pitch sizes 0.65
and 0.8mm
|
- Open top low
actuation force socket, with extremely reliable
2-point contact system
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|
| |
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 500V DC |
| Dielec. Withstd. Voltage: |
700V AC for 1 minute |
| Contact Resistance: |
30m max. at 10mA/20mV max. |
| Operating Temp. Range: |
–40°C to +150°C |
| Mating Cycles: |
10,000 insertions min. |
| Contact Force: |
20g -60g per pin |
| Operating Force: |
2.5kg max. |
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|
| Materials and Finish |
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| Housing: |
Polyetherimide (PEI), glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold over
Nickel | | |
