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Converter
BGA-Top-228 ZIF-CS
- top board of BGA converters
- ZIF socket accepts many variations of BGA packages, that differ in ball
diameter, ball width
and package thickness.
- The picture at Accepted package(s) section
shows the range of all dimensions of BGA packages,
which are accepted by this BGA-Top board.
- operation
(mechanical) life of ZIF socket - 500.000
actuations
- socket: ZIF BGA100, ClamShell type
- bottom: 4 rows, 4x25 pins, square,
0.6x0.6mm
- Order no.: 70-2260
- Price: €
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Converter manual
- For work with BGA device it is
necessary put together BGA-Top-228 ZIF-CS with some
BGA-Bottom-x board according to the information
provided by PG4UW software.
- Do not directly touch the pins of
the converter, because dirt may cause errors during
programming of device.
- The picture show, how to put
together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards
to have complete BGA converter
- For handling with the
device we recommended to use a
vacuum
pipette pick up tool.
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Accepted package(s)
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BGA package
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NAME |
SYMBOL |
MIN |
NOM |
MAX |
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Profile |
A |
- |
- |
1.4 |
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Ball Height |
A1 |
0.25 |
- |
- |
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Body Thickness |
A2 |
0.93 |
1.03 |
1.13 |
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Ball Diameter |
b |
- |
0.45 |
- |
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Body Size |
D |
17.9 |
18 |
18.1 |
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Body Size |
E |
13.9 |
14 |
14.1 |
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Ball Pitch |
e |
- |
1 |
- |
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Ball Array D |
GD |
- |
17 |
- |
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Ball Array E |
GE |
- |
10 |
- |
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NAME |
SYMBOL |
MIN |
NOM |
MAX |
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Profile |
A |
- |
- |
1.4 |
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Ball Height |
A1 |
0.25 |
- |
- |
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Body Thickness |
A2 |
- |
0.95 |
- |
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Ball Diameter |
b |
0.4 |
0.45 |
0.5 |
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Body Size |
D |
17.9 |
18 |
18.1 |
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Body Size |
E |
13.9 |
14 |
14.1 |
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Ball Pitch |
e |
- |
1 |
- |
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Ball Array D |
GD |
- |
17 |
- |
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Ball Array E |
GE |
- |
10 |
- |
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NAME |
SYMBOL |
MIN |
NOM |
MAX |
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Profile |
A |
- |
- |
1.4 |
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Ball Height |
A1 |
0.25 |
- |
- |
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Body Thickness |
A2 |
0.91 |
1.01 |
1.11 |
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Ball Diameter |
b |
- |
0.45 |
- |
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Body Size |
D |
17.9 |
18 |
18.1 |
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Body Size |
E |
13.9 |
14 |
14.1 |
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Ball Pitch |
e |
- |
1 |
- |
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Ball Array D |
GD |
- |
17 |
- |
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Ball Array E |
GE |
- |
10 |
- |
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