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Converter

BGA-Top-227 ZIF-CS

  • top board of BGA converters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operation (mechanical) life of ZIF socket - 500.000 actuations
  • socket: ZIF BGA25, ClamShell type
  • bottom: 4 rows, 4x25 pins, square, 0.6x0.6mm
  • Order no.: 70-1197
  • Price: € 382,00

Converter manual

  • For work with BGA device it is necessary put together BGA-Top-227 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter
  • For handling with the device we recommended to use a vacuum pipette pick up tool.

    Accepted package(s)

    BGA package

     

    NAME

    SYMBOL MIN NOM MAX

    Profile

    A - - 1.2

    Ball Height

    A1 0.2 - -

    Ball Thickness

    A2 - 0.79 -

    Ball Diameter

    b 0.35 0.4 0.45

    Body Size

    D 7.9 8 8.1

    Body Size

    E 5.9 6 6.1

    Ball Pitch

    e 1 -

    Ball Array D

    GD - 5 -

    Ball Array E

    GE - 5 -
     
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