BGA-Bottom-249
Order No.: 70-2331

bottom board of BGA adapters, assigned for NAND flash devices in 100-ball BGA packages with ONFI 2.x compatible pinout (asynchronous and/or SDR interface support)

Ord. no. 70-2331
Connection to BGA-Top-X 4x25 sockets for wire wrap pin
Bottom 2 rows, 2x24 pins square, 0.6x0.6mm,  row spacing 600mil
Class BGA/LGA
Subclass BGA-Bottom

Order no.: 70-2331
Price:        €108,00

Converter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • For work with BGA device it is necessary put together BGA-Bottom-249 with some BGA-Top-x board according the information provided by PG4UW software.
  • Operation conditions: operating temperature 5°C - 40°C (41°F - 104°F), operating humidity 20%...80%, non condensing.

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The information in this document are subject to change without notice.