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PDF file size: 84KB
 
Series: NP284 - Open Top
Title: Chip Scale Package (CSP)
 
Features
Pin counts 264
  • Pitch size 0.50mm
  • Open top socket for CSP packages
  • Self contacting struckture without upper pressing force
  • Fan-out terminal type, designed to reduce ball damage
 
Specifications
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 100V AC for 1 minute
Contact Resistance: 30m max. at 10mA/20mV max.
Operating Temp. Range: –40°C to +150°C
Contact force: 11gf per pin
Grid Size: 35 x 35
 
Materials and Finish 10,000 insertions min.
Housing: Polyethersulphone (PES), glass-filled and
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
 
 
 
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