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PDF file size: 41KB
 
Series: IC264 - Open Top
Title: Ball Grid Array (BGA)
 
Features
  • Pin count 225
  • Pitch size 1.5mm
  • Open top type sockets for BGA packages, with push-down frame for automated handling
 
Specifications
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 100V AC for 1 minute
Contact Resistance: 1 max. at 10mA/20mV 
max.
Operating Temp. Range: –40°C to +150°C
Mating Cycles: 10,000 insertions min.
Contact force: 25g to 35g per individual  
contact pin
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
 
 
 
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