 |
Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-IC Dimensions
-PCB
Layout
 Full Data Sheet
|
| PDF file size:
85KB | |
| Series: IC235-Open
Top |
| Title: Thin Small Outline Package (TSOP
II) |
| |
|
| Features |
|
- Pin counts 20, 24, 26, 28, 40, 44, 50 and
54
|
- Pitch sizes 0.8 and 1.27mm
|
- Open top low actuation force socket,
depopulation possible
|
| |
|
| Specifications |
|
| Insulation
Resistance: |
1,000M min. at
500V DC |
| Dielec.
Withstd. Voltage: |
700V AC for 1
minute |
| Contact
Resistance: |
30m max. at
10mA/20mV max. |
| Current
Rating: |
1A
max. |
| Operating
Temp. Range: |
–40°C to
+170°C
(–40°C to +150°C for -004
type) |
| Mating
Cycles: |
10,000
insertions min. |
| Contact
Force: |
20g min. per
pin at min.
displacement of 0.3mm
80g max. per pin at max. displacement of
0.7mm |
|
|
| Materials
and Finish |
|
| Housing: |
Polyetherimide (PEI), glass-filled |
| Contacts: |
Beryllium
Copper (BeCu) |
| Plating: |
Gold over
Nickel | | |
