DIL24/BGA24-2 ZIF HFlash-1
Order No.: 70-4498

specialized adapter for Spansion/Cypress Hyper Bus Flash S26KLxxx devices in BGA24 package
used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s) board
operation (mechanical) life of ZIF socket - 50.000 actuations
supported from PG4UW software version 3.36c
 
Ord. no. 70-4498
Socket ZIF BGA24, open top type
Bottom 2 rows, 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class Specialized
Subclass Memory (NOR/NAND/eMMC)

Order no.: 70-4498
Price:        €

Converter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • Insert adapter into programmer's ZIF socket. If you are in doubts about orientation of the adapter in programmer's ZIF socket, there is a rule of thumb - orientation of adapter's name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer's ZIF socket.
  • Push the cover of adapter's ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter's ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket. If device is inserted into only partially opened ZIF socket, then - after releasing of cover - the tweezer contacts might bend and if repeated several times this way tweezer contacts might even break.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in adapter's ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter's ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer's ZIF socket.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.
  •  

Accepted package(s)

BGA package

NAME

SYMBOL MIN NOM MAX

Profile

A - - 1.2

Ball Height

A1 0.25 0.3 0.35

Body Thickness

A2 0.65 - -

Ball Diameter

b 0.35 0.4 0.45

Body Size

D 7.9 8 8.1

Body Size

E 5.9 6 6.1

Ball Pitch

e - 1 -

Ball Array D

GD - 5 -

Ball Array E

GE - 5 -
   
     

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The information in this document are subject to change without notice.