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Converter
BGA-Top-28 ZIF-CS
- top board of BGA converters
- ZIF socket accepts many variations of BGA packages, that differ in ball
diameter, ball width
and package thickness.
- The picture at Accepted package(s) section
shows the range of all dimensions of BGA packages,
which are accepted by this BGA-Top board.
- operation (mechanical) life of ZIF socket - 500.000
actuations
- socket: ZIF BGA133, ((depopulated
array of (56) spring probes), ClamShell type
- bottom: 4 rows, 4x25 pins, square,
0.6x0.6mm
- Order no.: 70-0327
- Price: € 430,00
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Converter manual
- For work with BGA device it is
necessary put together BGA-Top-28 ZIF-CS with some
BGA-Bottom-x board according to the information
provided by PG4UW software.
- Do not directly touch the pins of
the converter, because dirt may cause errors during
programming of device.
- For handling with the
device we recommended to use a vacuum
pipette pick up tool.
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The picture show, how to put
together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards
to have complete BGA converter.
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Accepted package(s)
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BGA
package
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
0.9 |
1 |
1.1 |
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Ball Height
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A1 |
0.17 |
0.22 |
0.27 |
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Ball Thickness
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A2 |
- |
- |
- |
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Ball Diameter
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b |
0.25 |
0.3 |
0.35 |
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Body Size
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D |
12.9 |
13 |
13,1 |
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Body Size
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E |
9.9 |
10. |
10.1 |
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Ball Pitch
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e |
- |
0.5 |
- |
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Ball Array D
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GD |
- |
14 |
- |
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Ball Array E
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GE |
- |
14 |
- |
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