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Converter
BGA-Top-27 ZIF-CS
- top board of BGA
converters
- ZIF socket accepts
many variations of BGA packages, that differ in ball
diameter, ball width and package thickness.
- The picture at
Accepted package(s) section shows the range of all
dimensions of BGA packages, which are accepted by
this BGA-Top board.
- operation (mechanical) life of ZIF
socket - 500.000 actuations
- socket: ZIF BGA80, (depopulated
array of (64) spring probes), ClamShell type
- bottom: 4 rows, x
25pins, square, 0.6x0.6mm
- Order no.:
70-0323
- Price: € 430,00
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Converter manual
- For work with
BGA device it is necessary put together BGA-Top-27
ZIF-CS with some BGA-Bottom-x board according to the
information provided by PG4UW software.
- Do not
directly touch the pins of the converter, because
dirt may cause errors during programming of device.
- For
handling with the device we recommended to use a
vacuum pipette pick up tool.
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The picture show, how to put together the BGA-Top-x
ZIF-CS and BGA-Bottom-x boards to have complete BGA
converter.
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Accepted package(s)
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BGA package
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
- |
- |
1.2 |
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Ball Height
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A1 |
0.3 |
- |
- |
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Ball Thickness
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A2 |
0.64 |
- |
0.78 |
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Ball Diameter
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b |
0.4 |
0.45 |
0.5 |
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Body Size
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D |
- |
13 |
- |
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Body Size
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E |
- |
10 |
- |
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Ball Pitch
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e |
- |
1 |
- |
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Ball Array D
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GD |
- |
8 |
- |
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Ball Array E
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GE |
- |
8 |
- |
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
- |
- |
1.2 |
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Ball Height
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A1 |
0.2 |
0.3 |
0.35 |
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Ball Thickness
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A2 |
- |
0.8 |
- |
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Ball Diameter
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b |
0.35 |
- |
0.5 |
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Body Size
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D |
12.9 |
13 |
13.1 |
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Body Size
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E |
9.9 |
10 |
10.1 |
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Ball Pitch
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e |
- |
1 |
- |
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Ball Array D
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GD |
- |
8 |
- |
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Ball Array E
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GE |
- |
8 |
- |
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