|
|
 |
Converter
BGA-Top-241 ZIF
- top board of BGA converters
- ZIF socket accepts many variations of BGA packages, that differ in ball
diameter, ball width
and package thickness.
- The picture at Accepted package(s) section
shows the range of all dimensions of BGA packages,
which are accepted by this BGA-Top board.
- operation (mechanical) life of ZIF socket -
10.000 actuations
- socket: ZIF BGA90, open top type
- bottom: 8+3 rows, 8x25+3x20 pins, square,
0.6x0.6mm
- Order no.:
70-1414
- Price: €
|
|
|
Converter manual
- For work with BGA device it is
necessary put together BGA-Top-241 ZIF with some
BGA-Bottom-x board according to the information
provided by PG4UW software.
- The top cover must be fully
actuated (depressed) before inserting a package into
the socket.
- Once fully actuated, drop the
package into the socket from a height of 2 to 3mm
above the seating plane.
- Do not push package while loading
or releasing the lid.
- Do not directly touch the pins of
the converter, because dirt may cause errors during
programming of device.
- The picture show, how to put
together the BGA-Top-x ZIF-CS and BGA-Bottom-x
boards to have complete BGA converter
- For handling with the
device we recommended to use a
vacuum pipette pick up tool.
|
|
Accepted package(s)
|
|
BGA
package
|
 |
|
|
|
|
|
|
NAME
|
SYMBOL |
MIN |
NOM |
MAX |
|
Profile
|
A |
- |
- |
1 |
|
Ball Height
|
A1 |
- |
- |
- |
|
Ball Thickness
|
A2 |
0.6 |
0.65 |
0.7 |
|
Ball Diameter
|
b |
- |
0.45 |
- |
|
Body Size
|
D |
12.9 |
13 |
13.1 |
|
Body Size
|
E |
9.9 |
10 |
10.1 |
|
Ball Pitch
|
e |
- |
0.8 |
- |
|
Ball Array D
|
GD |
- |
15 |
- |
|
Ball Array E
|
GE |
- |
9 |
- |
|
|
|
|
|
|
