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Converter
BGA-Top-212 ZIF-CS
- top board of BGA converters
- ZIF socket accepts many variations of BGA packages, that differ in ball
diameter, ball width
and package thickness.
- The picture at Accepted package(s) section
shows the range of all dimensions of BGA packages,
which are accepted by this BGA-Top board.
- operation (mechanical) life of ZIF socket -
500.000 actuations
- socket: ZIF BGA76, (depopulated
array of (52) spring probes), ClamShell type
- bottom: 4 rows, 4x25 pins, square,
0.6x0.6mm
- Order no.:
70-1100
- Price: €
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Converter manual
- For work with BGA device it
is necessary put together BGA-Top-212 ZIF-CS with some BGA-Bottom-x board according to the
information provided by PG4UW software.
- Do not directly touch the
pins of the converter, because dirt may cause
errors during programming of device.
- The picture show, how to put
together the BGA-Top-x ZIF-CS and BGA-Bottom-x
boards to have complete BGA converter.
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Accepted package(s)
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BGA package
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
0.8 |
0.9 |
1 |
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Ball Height
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A1 |
0.17 |
0.22 |
0.27 |
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Ball Thickness
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A2 |
- |
- |
- |
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Ball Diameter
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b |
0.25 |
0.3 |
0.35 |
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Body Size
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D |
7.6 |
7.7 |
7.8 |
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Body Size
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E |
6.1 |
6.2 |
6.3 |
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Ball Pitch
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e |
- |
0.5 |
- |
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Ball Array D
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GD |
- |
14 |
- |
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Ball Array E
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GE |
- |
8 |
- |
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
- |
- |
1 |
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Ball Height
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A1 |
0.15 |
- |
- |
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Ball Thickness
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A2 |
- |
0.74 |
- |
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Ball Diameter
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b |
0.266 |
0.316 |
0.366 |
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Body Size
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D |
7.6 |
7.7 |
7.8 |
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Body Size
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E |
6.1 |
6.2 |
6.3 |
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Ball Pitch
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e |
- |
0.5 |
- |
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Ball Array D
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GD |
- |
14 |
- |
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Ball Array E
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GE |
- |
10 |
- |
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