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Converter

BGA-Top-203 ZIF-CS

  • top board of BGA converters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operation (mechanical) life of ZIF socket - 500.000 actuations
  • socket: ZIF BGA196, ClamShell type
  • bottom: 8+3 rows, 8x25+3x20 pins, square, 0.6x0.6mm
  • Order no.: 70-1051
  • Price: € 

Converter manual

  • For work with BGA device it is necessary put together BGA-Top-202 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
  • For handling with the device we recommended to use a vacuum pipette pick up tool.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter

 
 

Accepted package(s)

BGA package

  

NAME

 SYMBOL MIN NOM MAX

Profile

 A 0.8 0.9 1

Ball Height

 A1 0.18 0.23 0.28

Ball Thickness

 A2 0.62 0.68 0.74

Ball Diameter

 b 0.25 0.3 0.35

Body Size

 D 7.9 8 8.1

Body Size

 E 7.9 8 8.1

Ball Pitch

 e - 0.5 -

Ball Array D

 GD - 14 -

Ball Array E

 GE - 14 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1.2

Ball Height

 A1 0.15 - -

Ball Thickness

 A2 0.96 - -

Ball Diameter

 b 0.25 0.3 0.35

Body Size

 D - 8 -

Body Size

 E - 8 -

Ball Pitch

 e - 0.5 -

Ball Array D

 GD - 14 -

Ball Array E

 GE - 14 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1

Ball Height

 A1 - 0.23 -

Ball Thickness

 A2 - - -

Ball Diameter

 b 0.26 - 0.36

Body Size

 D - 8 -

Body Size

 E - 8 -

Ball Pitch

 e - 0.5 -

Ball Array D

 GD - 14 -

Ball Array E

 GE - 14 -
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