BGA-Top-168 ZIF-CS
Order No.: 70-0929

top board of BGA adapters
used ZIF socket may accepts one or more variants of supported package, different in ball diameter, ball high and/or body thickness. The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board
operation (mechanical) life of ZIF socket - 500.000 actuations

Ord. no. 70-0929
Socket ZIF BGA138, (depopulated array of (130) spring probes), Clamshell type
Bottom 8x25 + 3x20 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top

 

Order no.: 70-0929
Price:        €

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-168 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  

 

NAME

 SYMBOL MIN NOM MAX

Profile

 A 1 1.1 1.2

Ball Height

 A1 0.27 0.32 0.37

Body Thickness

 A2 - - -

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D 13.9 14 14.1

Body Size

 E 11.9 12 12.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 15 -

Ball Array E

 GE - 10 -
 

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The information in this document are subject to change without notice.