BGA-Top-157 ZIF-CS
Order No.: 70-0854

top board of BGA adapters
used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operation (mechanical) life of ZIF socket - 10.000 actuations
supported from PG4UW software version 2.46

Ord. no. 70-0854
Socket ZIF BGA44, ClamShell type
Bottom 4x25 pins square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top

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Order no.: 70-0854
Price:        € 595,00

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-157 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  

 

NAME

 SYMBOL MIN NOM MAX

Profile

 A 0.8  0.9 1

Ball Height

 A1 0.15 0.2 0.25

Body Thickness

 A2 - - -

Ball Diameter

 b 0.25 0.3 0.35

Body Size

 D 7.9 8 8.1

Body Size

 E 10.9 11 11.1

Ball Pitch

 e   0.5  

Ball Array D

 GD - 14 -

Ball Array E

 GE - 8 -
 

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The information in this document are subject to change without notice.