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Converter
BGA-Top-155 ZIF
- top board of BGA converters
- ZIF socket accepts many variations of BGA packages, that differ in ball
diameter, ball width
and package thickness.
- The picture at Accepted package(s) section
shows the range of all dimensions of BGA packages,
which are accepted by this BGA-Top board.
- operation (mechanical) life of ZIF socket -
10.000 actuations
- socket: ZIF BGA144, open top type
- bottom:
8+3 rows, 8x25+3x20 pins, square,
0.6x0.6mm, rows spacing 600mil
- Order no.:
70-0887
- Price: € 360,00
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Converter manual
- For work with BGA device it is
necessary put together BGA-Top-155 ZIF with some
BGA-Bottom-x board according to the information
provided by PG4UW software.
- The top cover must be fully
actuated (depressed) before inserting a package into
the socket. If the chip is inserted into only
partially opened ZIF socket, then - after releasing
of top - the tweezer contact might bend and if more
times done by this way also tweezer contact can be
broken.
- Do not directly touch the pins of
the converter, because dirt may cause errors during
programming of device.
- For handling with the
device we recommended to use a
vacuum pipette pick up tool.
- The picture show, how to put together the BGA-Top-x
ZIF-CS and BGA-Bottom-x boards to have complete BGA
converter.
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Accepted package(s)
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BGA package
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
1.35 |
1.45 |
1.55 |
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Ball Height
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A1 |
0.35 |
0.4 |
0.45 |
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Body Thickness
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A2 |
1 |
1.05 |
1.1 |
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Ball Diameter
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b |
0.45 |
0.5 |
0.55 |
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Body Size
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D |
12.8 |
13 |
13.2 |
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Body Size
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E |
12.8 |
13 |
13.2 |
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Ball Pitch
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e |
- |
1 |
- |
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Ball Array D
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GD |
- |
12 |
- |
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Ball Array E
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GE |
- |
12 |
- |
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
1.3 |
1.7 |
2.1 |
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Ball Height
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A1 |
0.3 |
0.5 |
0.7 |
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Body Thickness
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A2 |
0.3 |
0.5 |
0.7 |
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Ball Diameter
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b |
0.3 |
0.5 |
0.7 |
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Body Size
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D |
- |
13 |
- |
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Body Size
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E |
- |
13 |
- |
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Ball Pitch
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e |
- |
1 |
- |
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Ball Array D
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GD |
- |
12 |
- |
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Ball Array E
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GE |
- |
12 |
- |
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