DIL48/BGA80-1.1 ZIF NOR-1
Order No.: 70-3327

special adapter, assigned for Spansion S29PL127J80BFI010 devices in FBGA80 package designed for TurboMode
used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section: Accepted package(s)
operation (mechanical) life of ZIF socket - 10.000 actuations
supported from PG4UW software version 3.09t

Ord. no. 70-3327
Socket ZIF BGA80, open top type
Bottom 2 rows, 2x24 pins square, 0.6x0.6mm,  row spacing 600mil
Class Specialized
Subclass EPROM/Flash

Order no.: 70-3327
Price:        € 549,00

Converter manual

  • Insert converter to the device programmer ZIF socket according to the picture placed near of it. If you have some doubts about orientation of this converter in device programmer ZIF socket, it is valid general rule, the orientation of the text of title is the same as the text on the top of the device programmer.
  • Push the top of adapter ZIF socket to open it. Insert the device into the adapter ZIF socket. The right position of the programmed device in adapter ZIF socket is show at picture near (mainly left above) the adapter ZIF socket. On this picture reference corner (e.g. position of pin 1) of device is indicated by dot, by number 1, by bevelled corner or by any combination of them. Then release adapter ZIF socket.
  • Visually check interconnection between device and adapter ZIF socket. If everything looks OK, the device is ready for programming.
  • Be careful, because the incorrect insertion of converter to the device programmer ZIF socket or device to the converter ZIF socket can damage the programmed device.
  • When you finish work with adapter, remove it from the device programmer ZIF socket.
  • To take out the device, open converter ZIF socket and remove device from it.
  • When you finish work with converter, remove it from the programmer ZIF socket.
  • Do not directly touch the pins of the converter and converter ZIF socket, because dirt may cause errors during programming of device.
  • Operation conditions: operating temperature 5°C - 40°C (41°F - 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  

 

NAME

SYMBOL MIN NOM MAX

Profile

A - - 1

Ball Height

A1 0.18 - -

Body Thickness

A2 0.62 - 0.76

Ball Diameter

b 0.33 - 0.43

Body Size

D - 11 -

Body Size

E - 8 -

Ball Pitch

e - 0.8 -

Ball Array D

GD - 12 -

Ball Array E

GE - 8 -

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The information in this document are subject to change without notice.