AP1 BGA63-1.10 ZIF NAND-1 (LD)
Order No.: 71-4456LD

specialized programming module for Toshiba NAND Flash devices in BGA63 package 11x9mm, pitch 0.8mm
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operation (mechanical) life of ZIF socket - 10.000 actuations
supported from PG4UW software version 3.37a

Ord. no. 71-4456LD
Socket ZIF BGA63, open top type
Bottom 2 female connectors by 32 pins, DIN41612 B/2
Class Specialized
Subclass Memory (NOR/NAND/eMMC)

Order no.: 71-4456LD
Price:        €

Module manual

  • Protect the contacts of module's connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Proceed with care! Incorrect insertion of device in module's ZIF socket may lead to programmed device damage.
  • Unscrew 2 knurled thumb screws. Properly Insert programming module into Programmer Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programmer Module Interface connectors is possible. Screw 2 knurled thumb screws to fix programming module to programmer.
  • Push the cover of module's ZIF socket (the topmost movable part) to open the socket. Insert the device into module's ZIF socket. Correct position of programmed device in module's ZIF socket is indicated by picture near (usually on left above) the module's ZIF socket. On that picture, reference corner of device (e.g. position of pin 1) is indicated by dot, by number 1, by bevelled corner or by any combination of mentioned. Then release module's ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  •  Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in module's ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from module, push the cover of module's ZIF socket and remove the device.
  • When you finish the work with module, unscrew 2 knurled thumb screws and remove the module from Programmer Module Interface connectors.
  • For handling with the device we recommended to use a vacuum pick up tool.
  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Accepted package(s)

BGA package


NAME

SYMBOL MIN NOM MAX

Profile

A - - 1

Ball Height

A1 0.22 0.26 0.3

Body Thickness

A2 - - -

Ball Diameter

b 0.41 0.46 0.51

Body Size

D - 11 -

Body Size

E - 9 -

Ball Pitch

e - 0.8 -

Ball Array D

GD - 12 -

Ball Array E

GE - 10 -



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The information in this document are subject to change without notice.